Computer Hardware Reviews Daily Tech News

VR-Zon leaked out the first picture of the upcoming NVIDIA GeForce GTX 295 video card this morning. The GeForce GTX 295 is slated to launch at the Consumer Electronics Show (CES) this coming January.

The GeForce GTX 295 is based on the sandwich design again like the 9800GX2 with two 55nm GT200 GPUs. As you can see, there are 2 DVI and 1 Display Port. As for the power connectors, it uses 8+6 pins so that gives you a clue how much power this card needs. The pricing is yet to be disclosed but card makers are speculating that Nvidia will price it competitively against AMD 4870X2 card this time.

OCZ Technology Group today unveiled the Flex EX memory series, featuring breakneck speeds reaching 2000MHz that have demanded by enthusiasts in an updated compact form factor to maximize memory configurations on your motherboard. The new Flex EX series will be initially available in high-end solutions for gamers and overclockers utilizing water or passive cooling with more mainstream kits coming out down the road.

“Memory is the primary storage device of any modern computer system and defines how fast the CPU can access data,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “Density, frequency, and access latencies of the system memory are the critical factors for overall performance of any PC and that is where the new OCZ Flex Ex series sets new standards by providing the optimal combination of the three factors for any system architecture by offering unprecedented speed and latencies at 4GB density with advanced cooling options to enhance stability and performance in even the most demanding environments.”

Walton Chaintech introduced new APOGEE GT Triple-Channel DDR3 Memory Module Kits yesterday that are specifically for the Intel Core i7 processor / Intel X58 Express Chipset. The Chaintech kits come in DDR3-1333, DDR3-1600 & DDR3-1866 triple-channel speed grades, so they are launching numerous kits. These new modules will also be available in both 3GB and 6GB sits.

At the same time, all series of APOGEE GT Triple-Channel DDR3 Memory Module Kits are made of 8-layer PCB and chips of famous memory manufacturer, which are well known for their outstanding overclocking capability. Each chip is handpicked for meeting strict quality requirements. Not only that, all chips are manufactured of using Fine-Pitch Ball Grid Array (FBGA) packages to have better thermal dissipation and electrical efficiency. These unique technical features will ensure optimal performance via combination of lower voltage requirements, higher speed, and instantaneous overclocking ability.

It looks like the marketing crew over at Corsair Memory let Hexus leak out the details on their upcoming Dominator GT memory series that will be shown off at CES 2009. The 6GB DDR3 memory kit shown below is rated has tight CL7 timings at just 1.65V, which is mighty impressive. The image below looks to list the timings at 7-8-7-20, with the RAS-to-CAS delay keeping it from being 7-7-7. The new two tone color look is new for Corsair as the red trim on the label, but remember these are the GT's. With all the marketing leaks happening before CES I wonder if there will be anything left to show off during the expo.

The kit, pictured above in tri-channel form for Intel's X58 platform, consists of three 2GB modules that'll hit 2,000MHz at just 1.65V with low latencies of 7-8-7-20. That's pretty damn fast, and the low voltage should leave ample room for pushing these beauties a whole lot further.

Toshiba has announced plans to unveil the industry's first 512GB NAND-flash-based solid state drive. The 2.5-inch 512GB SSD expands Toshiba's family of fast read/write SSDs based on their 43-nanometer NAND. The new drives will be shown at this years International Consumer Electronics Show in Las Vegas.

In addition to the 2.5-inch, 512GB drive, the 43nm NAND SSD family also includes capacities of 64GB, 128GB, and 256GB, offered in 1.8-inch or 2.5-inch drive enclosures or as SSD Flash Modules. Samples of the new drives will be available in the first quarter (January to March) of 2009, with mass production in the second (April to June) quarter.